Compal Electronics will showcase its next-generation AI factory infrastructure at the OCP Global Summit 2026, focusing on the integration of megawatt-scale power, advanced cooling, accelerated computing and rack-level engineering. The company is developing an 800 V DC power architecture and megawatt-scale power infrastructure for increasingly dense AI data centers, alongside advanced liquid-cooling and megawatt-scale thermal-management capabilities. Compal says these systems must be designed as an interconnected platform rather than as separate computing, power and cooling components. The company will present the technologies at booth E65 and position its engineering and manufacturing resources as a bridge between NVIDIA AI technologies and large-scale deployment.