Broadcom has enlisted banks to arrange close to $60 billion in financing for AI chip purchases, extending its role from supplier to infrastructure financier. The package includes about $42 billion of senior-secured financing and an $18 billion junior-debt component led by Blackstone, which plans to commit $9 billion and distribute the remainder. A separate Anthropic filing showed Broadcom agreed to provide up to $42 billion in loans tied to the company’s infrastructure commitments and a potential $125.2 billion five-year TPU lease. The financing could support sales of Broadcom’s chips and data-center equipment while giving Anthropic and similar companies more capacity to expand computing resources. Taiwan Semiconductor Manufacturing Co. shares rose 2.64% to $471.32 as the broader chip sector gained, while Samsung was reportedly quoting mid-to-high $4 per gigabit for 2027 HBM4 supply, roughly three times the price of current HBM3E chips.