TSMC’s CEO said the company’s CoPoS advanced packaging technology is already operating on a trial production line, with output expected to increase significantly over the next two to three years. He also said TSMC is expanding mature-process wafer capacity in Japan for CMOS image sensors and in Germany for automotive and industrial demand, while steering clear of sharp price increases. The remarks point to a two-track manufacturing strategy: building out cutting-edge packaging used to integrate high-performance chips, while also reinforcing older-node capacity that remains important for sensors, vehicles and industrial applications.