MarketsandMarkets projects 31.2% annual growth from 2026, with North America leading market value and demand driven by AI, hyperscale and direct-to-chip liquid-cooling deployments.
The data center liquid-cooling manifolds market is projected to grow from USD 0.94 billion in 2026 to USD 6.33 billion by 2033, according to MarketsandMarkets, implying a 31.2% CAGR over the period. The report links the expansion to rising power densities from AI, machine learning and high-performance computing workloads, which are making traditional air cooling less effective and increasing adoption of liquid-cooling systems that need manifolds to distribute coolant across racks and servers. North America is expected to post the highest regional CAGR at 32.3% and also account for the largest market share by value during the forecast period. By segment, in-rack manifolds are projected to grow the fastest at a 33.6% CAGR, row-based manifolds are expected to hold the largest share, direct-to-chip cooling is forecast to post the highest growth among cooling technologies at 30.8%, the hyperscale data center segment is expected to grow the fastest, stainless steel manifolds are likely to hold the largest 2033 share while polymer-based manifolds are expected to grow the fastest, aisle-mounted designs are set to retain the largest share, and new installations are seen as the fastest-growing installation type and a prominent 2033 segment.