ASE, the world’s largest OSAT provider, raised July 1 quotes for advanced packaging including CoWoS and FoCoS by as much as more than 20%, reflecting tight capacity, AI-driven demand and higher costs.
ASE Technology Holding again raised prices for advanced chip-packaging services on July 1, with some quote increases exceeding 20%. The increases cover advanced packaging technologies including CoWoS and FoCoS and affect major U.S. clients, according to industry reports. Sources attributed the move to persistently tight advanced-packaging capacity, strong AI-related demand, higher raw-material and investment costs, and increased outsourcing from TSMC, conditions that have kept utilization near full and supported pricing power.