
The Hiroshima project will make advanced memory including HBM for AI processors, with Japan offering up to ¥500 billion in subsidies and production expected to begin around summer 2028 amid intensifying AI memory competition.
Micron Technology has broken ground on a roughly ¥1.5 trillion, or $9.3 billion, expansion in Hiroshima to produce advanced memory chips including high-bandwidth memory, a key component for AI accelerators. Japan’s Ministry of Economy, Trade and Industry is providing up to ¥500 billion in support, underscoring Tokyo’s push to strengthen domestic semiconductor manufacturing and AI-related supply chains. Production is expected to begin around summer 2028. The project comes as Micron, SK Hynix and Samsung Electronics race to expand HBM output to meet fast-rising demand from AI model training and inference, while customers increasingly lock in long-term supply years before new capacity comes online. Micron has also tied its AI strategy more closely to customers through a recent strategic agreement with Anthropic that includes memory architecture work, a multi-year supply deal and an investment in Anthropic’s Series H financing.