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Broadcom and Apple extend custom chip partnership through 2031

Broadcom and Apple extend custom chip partnership through 2031

Apple said it plans to spend more than $30 billion with Broadcom over five years, tying the supplier relationship to expanded U.S. chip production and a $1.5 billion Colorado facility expansion.

Fact Check
Multiple independent July 6, 2026 sources corroborate the claim. The BlockBeats item cites a U.S. SEC filing stating Broadcom and Apple extended technology cooperation to 2031 via a new multi-year agreement covering custom ASIC silicon for multiple Apple product generations. PANewsLab cites a Bloomberg article (2026-07-06) confirming the extended custom chip supply/development partnership through 2031, built on existing RF and wireless connectivity chips with multibillion-dollar purchase commitments, matching the claim precisely. Odaily provides consistent corroboration. Confidence is medium rather than high because the primary SEC filing and Bloomberg original were not directly fetched, only credible secondary reporting citing them.
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Summary

Broadcom and Apple have extended their custom chip partnership through 2031, with Apple saying it plans to spend more than $30 billion with Broadcom over the next five years as it expands domestic semiconductor production. Apple said the multi-year agreement will help drive production of more than 15 billion chips in the United States and includes a $1.5 billion expansion of Broadcom’s facility in Fort Collins, Colorado. The partnership builds on Broadcom’s long-standing role supplying Apple with wireless and connectivity components and now more explicitly covers U.S.-made custom silicon. Broadcom said in a Securities and Exchange Commission filing that it entered new long-term agreements with Apple to develop and supply custom ASIC silicon products for multiple generations of Apple products through 2031. Apple said Broadcom will make wireless components that help devices connect to cellular, Wi-Fi and Bluetooth networks. The company cast the agreement as part of its broader U.S. manufacturing push, saying it is the largest commitment so far under its American Manufacturing Program and the biggest element of Apple’s $600 billion, four-year U.S. investment plan announced in 2025.

Terms & Concepts
  • custom ASIC: An application-specific integrated circuit designed for a particular task or product rather than for general-purpose computing.
  • wireless components: Semiconductor parts that enable device connections to networks such as cellular, Wi-Fi and Bluetooth.
  • American Manufacturing Program: Apple’s initiative aimed at expanding domestic production across its supply chain.