Back
SK Hynix starts mass HBM4 shipments for Nvidia’s Vera Rubin platform

SK Hynix starts mass HBM4 shipments for Nvidia’s Vera Rubin platform

SK Hynix has moved 12-layer HBM4 from samples to certified final-spec shipments for Nvidia, as CEO Jensen Huang said the Vera Rubin chip has entered production and broader memory deliveries will expand from September.

Fact Check
The MemoryMarket source directly confirms SK hynix began mass 12-layer HBM4 shipments to Nvidia for Vera Rubin after completing all quality certifications, described explicitly as the first final-spec supply beyond samples, matching the claim's 'samples to certified final-spec shipments' framing. TechTimes documents Jensen Huang confirming Vera Rubin is in production with HBM4 suppliers active and Q3 2026 shipments. Korea Herald corroborates HBM4 mass production for Vera Rubin and references September timing for scaling. The main sources are secondary/market-news rather than direct Nvidia or SK Hynix official pages, so the specific September expansion phrasing is slightly less firmly primary-sourced, but all core factual elements are consistently corroborated across independent outlets.
    Reference: 123
Summary

SK Hynix has begun mass shipments of its 12-layer HBM4 to Nvidia as a certified final-spec product, marking a shift from earlier sample deliveries and supporting Nvidia’s next-generation Vera Rubin AI platform. Nvidia CEO Jensen Huang said the Vera Rubin chip has entered production and is progressing smoothly. SK Hynix said HBM4 volumes are now in a capacity ramp-up phase and will formally expand from September to meet demand for high-end AI compute chips.

Terms & Concepts
  • HBM4: Fourth-generation high bandwidth memory used in advanced AI and high-performance chips.
  • Vera Rubin: Nvidia’s next-generation AI platform referenced in the report.
  • capacity ramp-up: The phase in which production volumes are increased after initial manufacturing starts.