India has approved a major expansion of domestic electronics manufacturing support, combining earlier incentives for semiconductor design, chipmaking and mobile phone production with a cabinet-backed semiconductor pipeline under the India Semiconductor Mission. The older package allocated ₹1,27,500 crore for semiconductor design and manufacturing and ₹62,500 crore for mobile phones, while the newer update says 12 semiconductor projects across six states represent roughly ₹1.64 lakh crore, or about $19.7 billion, in combined investment. The projects span fabs, compound semiconductor facilities, and OSAT/ATMP operations, with Tata Electronics, Micron Technology, CG Power, and an HCL-Foxconn joint venture among the participants. Micron inaugurated its $2.75 billion ATMP facility in February 2026, and four semiconductor plants are expected to begin commercial production in 2026, though such timelines remain subject to execution risk.