AMD says Helios AI rack is in production as Samsung HBM4 talks near completion

AMD said its Helios AI rack is in production, with CEO Lisa Su saying at the company’s Advancing AI event that shipments are expected to begin soon, with the newer report specifying late in the third quarter. At the same event, Schneider Electric and AMD unveiled a validated reference design for Helios-based high-density AI deployments supporting racks of up to 246 kW and modular clusters of up to 10.4 MW IT capacity. Separately, Su said AMD is close to completing a formal agreement for Samsung Electronics to supply HBM4 at scale, according to Seoul Economic Daily, with additional talks covering broader HBM4 supply and possible foundry cooperation. Su also said on July 23 at the Advancing AI 2026 conference that AI chip demand is expanding faster than AMD had previously forecast, raising her estimate for the global AI chip market to about $1.4 trillion by 2030 from an earlier projection of $500 billion by 2028, while saying GPUs are likely to retain the largest share because algorithms and workloads are evolving rapidly.