The preliminary agreement covers key glass substrate packaging processes as Intel advances a longer-term push into chip architectures aimed at denser AI computing.
Lens Technology said its wholly owned unit, Lens International (Hong Kong) Limited, has signed a one-year memorandum of understanding with Intel Corporation on cooperation in through-glass via advanced packaging. The preliminary agreement covers glass substrate via formation, high-precision laser processing, metallized via deposition and multilayer interconnect routing, and may be extended by mutual agreement. The development ties Lens Technology's glass manufacturing capabilities to a semiconductor packaging area gaining attention as chipmakers seek denser, more thermally stable architectures for AI accelerators. Intel announced its glass substrate technology in September 2023 and has said it is targeting commercial readiness between 2026 and 2030 after investing more than $1 billion in research, development and supply chain buildout, with a goal of enabling packages containing up to 1 trillion transistors by 2030. Lens Technology, listed in Hong Kong under ticker 6613, has been expanding beyond smartphone glass into AI infrastructure components, with integrated solutions for AI servers already shipping and SSD assembly expected to scale through 2026.