Topco Scientific posts record Q2 2026 revenue and profit as AI, HPC demand lifts semiconductor materials shipments

Taiwan semiconductor materials distributor Topco Scientific said quarterly revenue topped NT$20 billion for the first time, while first-half profit jumped on stronger demand tied to advanced processes and packaging.

Summary

Topco Scientific reported record second-quarter 2026 results as rising global demand for artificial intelligence and high-performance computing drove broader semiconductor materials shipments. Consolidated revenue reached NT$20.83 billion, up 12.3% from the prior quarter and 22.6% from a year earlier, while net profit attributable to parent company shareholders rose to NT$1.54 billion and EPS climbed to NT$7.92, both all-time highs. First-half consolidated revenue totaled NT$39.36 billion, up 20.2% year over year, with net profit attributable to parent company shareholders of NT$2.86 billion, up 54.2%, and EPS of NT$14.79. The company said demand was supported by wafer foundry customers accelerating advanced process and advanced packaging deployments, boosting shipments of photoresist, silicon wafers, quartz, wafer carriers and slurries. Looking ahead, Topco expects second-half operations to be supported by high fab utilization, stronger silicon wafer volumes and a growing environmental engineering backlog that has doubled to about NT$14 billion, alongside customer expansion in Taiwan, the United States, Japan and Southeast Asia.

Terms & Concepts
  • high-performance computing: Computing workloads that require large processing power, often supported by advanced chips and data-center infrastructure.
  • advanced packaging: Chip assembly methods that improve performance and efficiency by connecting or stacking semiconductor components more tightly.
  • long-term agreements: Multi-year supply contracts that can lock in pricing and volumes between companies and their customers.