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Memory Shortage Seen Lasting Through 2027 as Top Suppliers Sell Out Capacity

Memory Shortage Seen Lasting Through 2027 as Top Suppliers Sell Out Capacity

Samsung, SK Hynix and Micron have reportedly allocated all 2027 DRAM and HBM output, with customers receiving only 60% to 70% of requested volumes.

Fact Check
The DigiTimes primary source (Aug 4, 2026) directly confirms 2027 memory capacity is reportedly sold out. The Chosun Ilbo/Naver article confirms the supercycle extending to 2029-2030, the 60-70% partial fulfillment of customer requests, priority for cloud/AI customers, and structural HBM shortage through 2027. Independent financial press confirms the $146B 2027 capex figure, and multiple exchange news feeds corroborate the NAND booking details. The claim's core elements are consistent across primary and secondary sources; the main caveat is that these are supply-chain reports/estimates ('reportedly'), and one search result noted a countervailing view that shortages could turn to a glut by 2028.
Summary

The memory market is tightening further as Samsung, SK Hynix and Micron have reportedly allocated all of their expected 2027 DRAM and HBM supply, reinforcing industry expectations that shortages could persist through 2027. Industry sources said the three major producers have largely completed next year's capacity allocation talks and have no plans to add new capacity, with customers ultimately receiving only 60% to 70% of their initial requested volumes. The report points to 2027 as the most severe phase of the memory shortage, even though final pricing is expected to be set closer to delivery. The latest supply update builds on an already constrained market in which AI demand and HBM production have been absorbing capacity across the industry. Earlier data showed contract prices for traditional memory products hitting records in July, while spot-market momentum began to cool. Counterpoint Research's global memory tracker showed Samsung held a 39% share of the DRAM market in the second quarter, followed by SK Hynix at 26% and Micron at 25%.

Terms & Concepts
  • DRAM: Dynamic random-access memory used in computers, servers and other electronics.
  • HBM: High-bandwidth memory, an advanced memory type widely used in AI hardware.